导电衬垫材料在抑制电子设备缝隙电磁泄漏中发挥了重要作用，是目前电子设备中应用最为广泛的一类屏蔽材料。
Conductive gasket material is one of the most widely used shielding materials at present, and plays an important role on the suppression of electromagnetic slot -leakage in electronic equipment.
研究表明，玻璃纤维化学镀铜后，可提高导电性能，并用作制备电磁屏蔽材料。
Results showed that the conductive performance of glass fiber with copper plating increased greatly so that the material could use as electromagnetic shield.
纳米石墨微片有望在导电材料、电磁屏蔽材料、电加热材料等领域得到应用。
Promising applications were expected in the fields of electrical conducting, electronic-magnetic shielding and heating materials, and so on.
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