pcb的制制过程由玻璃环氧树脂(glass epoxy)或类似材量制成的pcb基板起头。制制的第一步是光绘出零件间联机的布线，其体例是采用负片转印(subtractive transfer)的体例将设想...
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研究了玻璃粉／环氧树脂封接复合材料的制备与性能。
The preparation and properties of superfine glass powder/epoxy resin composites were studied.
应用：适合木制品、纸张、皮革布料、有机玻璃、环氧树脂、亚克力、不饱和聚酯树脂等非金属材料。
Applications: Suitable for wood, paper, leather, fabric, acrylic, epoxy, acrylic, unsaturated polyester resin and other non-metal materials, etc.
本文研究了拉伸载荷下，粉煤灰填充物短玻璃纤维增强环氧树脂的影响。
In this paper, the effect of short fibreglass reinforced epoxy filled with fly ash was studied under pulling load.
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