Along with Surface Mount Technology (SMT) has been applied widely in the electronic industry. The fine powders of the solder alloy is one of the key materials in the SMT.
随着表面组装技术(SMT)在电子工业中广泛应用,无铅焊锡合金微粉的研究和开发成为电子材料领域的热点问题之一。
参考来源 - Sn·2,447,543篇论文数据，部分数据来源于NoteExpress
需用合金成份请参照常用焊锡合金表。
For the content of alloy, please refer to the table for commonly used solder alloy.
需用合金成份请参照常用焊锡合金表。
For the alloy contents, please refer to the table of commonly used bar solder alloy.
我公司还备有其它成份焊锡供客户选择，请参照常用焊锡合金表。
Our company also has solders of other contents for the option by clients. Please refer to the Table of Commonly Used solder Alloy.
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