文章对Q FN器件的焊盘设计，网板设计及组装工艺作了详细的介绍。

In this article, bonding pad design, stencil design and assembly process of QFN device will be introduced in detail.

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表面贴装印制板设计直接影响焊接质量，将专门针对表面贴装印制板的焊盘设计、布线设计、定位设计、过孔处理等实用技术作一些探讨。

Design of surface mount PCB makes an impact on soldering quality. The design of soldering pad, track layout, location and through hole treatment are discussed.

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焊盘的谐振输出是系统设计的关键。

The design of resonant disk is the key of the system.

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