...字: 温度循环载荷； 表面组装焊点； 应力—应变场；动态特性； 有限元数值模拟[gap=931]Key words: temperature cycling load； surface mount solder joints； stressstrain field； dynamic feature； finite elem..
基于24个网页-相关网页
研究了温度循环载荷下叠层芯片封装元件(scsp)的热应力分布情况，建立了SCSP的有限元模型。
A finite element modeling of SCSP was performed. The distribution of thermal stress of SCSP under temperature cycle was analyzed.
实验温度为室温，循环应变比和应力比均为0.1，载荷波形为三角波。
The fatigue tests were performed at room temperature and cyclic strain and stress ratio of 0.1 with triangle load wave.
目的研制冷热循环机械载荷咀嚼模拟疲劳试验机来人工模拟口腔环境的温度变化和咀嚼负荷，检测口腔材料的疲劳寿命。
Objective to design a new kind of thermocycling and mechanical loading (TCML) chewing simulator and test the chronic fatigue characteristics of dental materials and prosthesis.
应用推荐