·2,447,543篇论文数据，部分数据来源于NoteExpress
熟悉深亚微米工艺设计规则。
随着深亚微米工艺的广泛应用，瞬态故障已成为芯片失效的主要原因。
Since deep submicron manufacturing process is widely used in microprocessors, transient faults have become the main source of chip faults.
超深亚微米工艺下，串扰的出现会导致在电路设计验证、测试阶段出现严重的问题。
Current design trends have shown that crosstalk issues in deep sub-micron can cause severe design validation and test problems.
应用推荐