该方法克服了传统测量方法测量不准确和难以测量的问题。
This method solves problems of inaccurate measurement and measurement difficulties for classical approach.
从最大的膜厚刻度值开始,减少由于表面张力导致测量不准确的风险。
Begin at maximum thickness to reduce risk of inaccuracy caused by surface tension.
基片的弯曲导致光线入射角度产生偏差,此角度偏差使波长测量不准,插损增加;
The substrate bend induced the deviation of incidence angle that cause the inaccuracy of wavelength measurement and increase the insert loss;
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