薄型化导光板是近年来背光模组设计的重点。
In recent years, the light guide plate design is focused on ultra-thin.
负责高阶摄像头器件选型及模组设计开发，模组制程开发验收，样品生产交付；
Responsible for the high order camera device selection and module design and development, check and accept the module system processing, sample production delivery.
功率放大器模组设计，使用负载牵引特性原理功率放大器被合并使用三分贝正交耦合器。
Power amplifier Modules were designed using Push-Pull BJT power amplifiers that were combined using 3db Quadrature couplers.
应用推荐