解决方法要么是减少口模出口应力，要么是减少组分从熔体中分离的倾向。

Solutions are either to reduce die-exit stress or to reduce the tendency for components to separate from the melt.

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有时，较低的口模温度会在口模内表面上生成一个冷却的树脂层，这个树脂层慢慢地移出到口模出口，然后与本体料流分离，从而引起积料。

Sometimes lower die temperatures can create a cool layer of resin on the inner surface of the die that creeps slowly to the die exit and then separates from the bulk flow, causing buildup.

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分离光纤线路中的两个偏振模式对于提高偏振模色散补偿的精度和速度有重要意义。

Splitting two modes from an optical fiber line is of great importance for the accuracy and speed of compensation.

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