影响脱模的原因常常是差的模具冷却效果，而这又是由于缺乏冷却剂，而不是温度的设定所致。
Frequently the cause is poor mold cooling and this is frequently caused by a lack of coolant rather than its temperature.
只要预先设定好胶合电流值和时间，本系统会根据电流的反馈信号自动调节，胶合电流不会受到厚薄的变化和模具温度上升的影响。
As long as the pre-set current value and a good bonding time, the system based on current feedback signal auto - Regulation, will not be glued current thickness change and mold temperature rise.
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