... 引线框架电镀设备介绍 LeadFrame Plating 双列直插式引线框架 dip lead frame ; dualinlineleadframe 框架引线 support lead ...
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引线框架 [电子] Lead Frame ; ib-t ; led Lead frame
双列直插式引线框架 dip lead frame ; dual in line lead frame
矩阵式引线框架 matrix frame
引线框架材料 Lead Frame Material ; material for lead frame
引线框架用合金 lead frame alloy
微引线框架 MLF
金属引线框架 Metal lead frame
镍钯金预电镀引线框架 ni/pd/au pre-plated lead frame
引线框架电镀设备介绍 lead frame Plating
研究了在铜合金表面电镀纯铜层保护膜对铜合金引线框架氧化失效的影响。
The effects of surface electroplate pure copper on oxidation failure of lead frame copper alloys for IC package were investigated.
自动冲切成形系统是半导体集成电路封装引线框架后的加工专用系统。
The automatic cutting system is a special equipment for processing the lead frames of semiconductor ICs after encapsulation.
介绍了IC引线框架级进冲模的特点并着重讲述了其排样设计中的整形工位和模具结构中的卸料、微调和安全机构，可供精密级进冲模设计参考。
The traits of progressive die for IC lead frame have been introduced with emphasis on the ironing stage in layout design and stripping micro-adjustment, safety setup of the structure.
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