针对晶圆制造系统的多重入特性，提出了层周期、逻辑层数等概念。
In view of the multiple re-entrant characteristics of wafer manufacturing systems, this paper presents some concepts such as cycle time per layer and logical layer number.
针对半导体晶圆制造系统中瓶颈设备动态漂移的特性，提出一种动态瓶颈实时派工策略。
According to the characteristics of dynamic bottleneck in semiconductor wafer fabrication system (SWFS), a dynamic bottleneck real-time dispatching (DBRD) strategy was proposed.
针对半导体晶圆制造系统中瓶颈设备动态漂移的特性，提出一种动态瓶颈实时派工策略。
The general structure of semiconductor manufacturing system and solutions of its information exchanging are presented.
应用推荐