烧结早期WC晶粒长大是在晶粒旋转合并机制与局部液相烧结机制共同作用下完成。
And WC grains are grown up based on the grain rotation combination mechanism and local liquid-phase sintering in the early stages of sintering.
本研究可应用于圆柱工件之预锻及扣件旋转锻造，未来更可用于精微成形以减少晶粒尺寸大小。
In the near future, the rotating compression forming can be used in the micro-meso forming to reduce the grain size.
对两种晶粒尺寸的中碳钢光滑试样进行了旋转弯曲疲劳试验；应用复型技术监测了短裂纹形成与扩展过程，研究了晶粒尺寸对短裂纹行为的影响。
The process of crack initiation and propagation was observed through replication, and the effect of grain size on the behaviour of short fatigue cracks was studied.
应用推荐