需要注意的是，上面所说的200mm规格产线计划6月15日恢复量产，此日期指的是工厂可以开始接受200mm晶圆片开始加工的日期，而从晶圆片上制出芯片并对其进行封装，制成可以直接销售给客户的成品，则可能需要再等上2.5-3个月。

The June 15 date is a wafers-in start date. It can take up to three months for a wafer to be processed and packaged for shipment to customers.

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七：1。清洗时调设备磨刷所致。2。成品检验员误放所致，当时有挑选出来2片。

Seven: 1. ShiDiao cleaning equipment caused by abrasive brush. 2. The finished product inspectors mistakenly put, and there was selected by 2 slices.

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象这样是整拼版的不良，如果成品检验发现1片，就一定要查出和拼版数符合的不良板。九。

The whole idea is like this bad, if finished goods inspection found 1 piece, must find out-with the number and bad board. 9

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