这些漏洞被称为微焊。

These holes are called micro vias.

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介绍了在集成电路制造封装中采用的激光微调、激光打孔、激光清洗、激光柔性布线和激光微焊技术。

Research progresses of laser trimming, laser drilling, laser cleaning, laser flexible routing and laser micro welding applied in the IC fabrication and packaging are given.

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这也从分形理论的角度证明了在超塑性固相焊接头的形成过程中，焊接面各微区的焊合状态是非均匀性的。

It is proved by fractal theory that the welded state of every micro zone at welded surface is uneven in the formation process of isothermal superplastic solid-state welding joint.

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