将实现3d互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.
本文还分析了saw滤波器上面引线间的串扰问题，简化为平行双导线间串扰的耦合模型进行分析。
This paper also analyzes crosstalk coupling of SAWF down-leads by the coupling model between two parallel transmission lines.
关于线圈引线提高的范围，它是有限的导线直径的一部分。
About coil lead wire raise up range, it is limited as a part of lead wire diameter.
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