从唯象观点分析了循环变形期间相变应力和弹性模量的变化。
The change of transformation stress and the modulus of elasticity during cyclic deformation was analyzed from the continuum mechanical point of view.
采用定点激光反射热循环方法，测量了硅基体上铜膜应力随温度的变化及等温松弛。
The stress variation with temperature and isothermal relaxation in copper films deposited onto silicon wafers are studied by fixed point laser reflection method.
同时，在各个冲击功下，材料的磨损机理在冲击应力的循环作用下随时间发生明显变化。
Furthermore, at all impact power, the wear mechanism of the material changes distinctively with the time under the cyclic impact stress.
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