... 层间接触 印制电路板的ninterlayer contact 层间连接 interlayer connection 层间阻抗 layer impedance ...
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由此，得到一种层间连接部被压缩且具有高连接可靠性的多层印刷线路基板。
Therefore, the interlayer connecting section is compressed, and the multilayer printed wiring board having high connection reliability is obtained.
它提供了很多可供较高层和较低层驱动器使用的函数，因而可以充当这两层间的连接层。
It provides a number of functions that are used by upper - and lower-level drivers and, therefore, serves as the glue between these two distinct layers.
由于系统与底层基础设施间的连接是松耦合的，所以它能轻易地运行在任意IaaS层之上。
The system is decoupled from the underlying infrastructure and therefore easy to get running within any IaaS layer.
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