微波立体组装工艺是实现微波组件小型化、轻量化、高组装密度和优良电气性能的有效途径。
Microwave volume packaging technologies are effective methods for realizing microwave modules miniaturization and weight reduction with high density and good performance.
散热性好，利用FPC可大大缩小装置的体积，使装置实现小型化、轻量化、薄型化。
Heat, good use of FPC can greatly reduce the size of devices to enable devices to achieve small, lightweight, thinner.
使用薄膜沉积法制作16阶菲涅耳透镜，用它代替常规的光学透镜可实现系统的轻量化、小型化，并增加系统设计的自由度。
The thin film deposition is used to make 16 step Fresnel lens . It can implement system′s lightweight, miniaturization and increase free degree of the design.
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