利用统计分析手段，对高功率二极管激光器封装中各工艺环节引起器件失效的原因进行了分析和归类。
Using statistics analysis method, diode laser failure states were classified and the causes of these diode laser failures were analyzed in every packaging process.
主要介绍了一种新型发光二极管（LED）自动封装机注胶系统的工作原理以及应用可编程控制器（PLC）和位控单元对其进行自动化的控制。
The article introduces the principle of the new LED automatic encapsulation equipment's infuse jelly system and automatic control by applying PLC and position control units.
制备了两种1 W白光功率发光二极管（LED）， 这两种样品分别是对台湾和美国两家公司生产的蓝光芯片， 涂敷相同荧光粉和透明硅胶封装而成。
Two kinds of 1 W white high power light emitting diode (LED) were made by packaging blue chips from Taiwan and US. The chips were coated by the same phosphor and transparent silica gel.
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