... packaging 包装，封装，组件，插件，标准部件 packaging density 封装密度 packaging machine 打包机 ...
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... density gradient 密度梯度 density of packaging 封装密度 density of states 态密度 ...
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随着封装密度的进一步提高，其热失效问题也变得更加严重。
Along with the increase of package density, the issue of ASIC thermal failure has become more and more important.
集成电路技术中的一种修饰术语，表示元件体积小而且封装密度高。
In relation to an integrated circuit; a term that indicates small element size and high packing density.
随着特征尺寸以及封装密度的增加，目前的封装冷却技术将很快不能适应。
As feature sizes and package densities increase, current package-level cooling techniques will soon become inadequate.
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