研究了温度循环载荷下叠层芯片封装元件(scsp)的热应力分布情况，建立了SCSP的有限元模型。
A finite element modeling of SCSP was performed. The distribution of thermal stress of SCSP under temperature cycle was analyzed.
SCSP的焊点热疲劳寿命模拟值为1 052个循环周，低于单芯片封装元件的焊点热疲劳寿命(2 656个循环周)。
The simulation value of solder joint thermal fatigue life is 1 052 circulations. The thermal fatigue life of solder joint in SCSP is lower than the single chip package (2 656 circulations).
制造一部手机的成本和它在商店里的价格之间的差距应该会进一步扩大，因为以前元件被封装在一个主芯片上。
The gap between the cost of building a phone and its price in the shops should widen further as previously components are packed onto a single main microchip.
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