插座外壳包括利用金属屏蔽层进行金属化的不导电衬底。
The jack housing includes an electrically non-conductive substrate metallized with a metal shield layer.
光阴极由衬底(包括介质阴极的导电基底)和光电发射膜构成。
The photocathode consists of a substrate (involving a conductive base film for dielectric cathode) and a photoemission film.
一层或多层中间导电层形成于顶部导电层和衬底之间。
The one or more intermediate conductive layers are formed between the top conductive layer and the substrate.
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