它利用半导体制冷器对大功率半导体激光阵列吸热，然后经由风冷散热。
The heat of high power semiconductor laser array is absorbed by a semiconductor refrigerator and dissipated by air cooling.
该模拟结果对大功率半导体激光器阵列的封装设计具有现实的指导意义。
The simulation results can guide the packaging of the high power semiconductor laser array.
大功率半导体激光器阵列(LDA)的应用日益广泛，但受其发光机制的限制，光束质量较差。
The application of high-power laser diode arrays (LDA) is becoming wider and wider, but the quality of output beams from LDA is poor for its unique mechanism of luminescence.
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