本文报告了一种基于低温共烧陶瓷技术和金锡共晶焊料的射频微机电的封装技术，并评估了该封装结构的物理及射频特性。
This paper reports on an RF MEMS package based on LTCC technology and gold-tin eutectic bonding, and also evaluates physical and RF characteristics of the proposed structure.
介绍一种基于交流采样技术的新型微机电量变送器，并且针对其特点提出了对其自检的方法。
A new type of microcomputer transducer of electric variables is introduced, which is based on AC samples.
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