本文首次用激光作激励光源,在P型硅片上成功地进行了光电化学成像沉积,得到层次清晰的图像。
Laser is used as active light source for the first time in photoeleotrochemioal image deposition on P-type silicon substrate, and pictures with clear structures are obtained.
加速度计用普通的N型硅片制造,为了刻蚀高深宽比的结构,使用了深反应离子刻蚀(DRIE)工艺。
This accelerometer is fabricated by N type silicon wafer. To obtain high aspect ratio structure, deep reactive ion etching(DRIE) process is employed.
不过,他表示,可以利用类似的技术实现硅片所无法做到的,比如,制造能检测传染病的智能型绷带,或者能感应食品是否新鲜的包装。
But similar technology could be used to do things silicon can't do, he says, such as make smart bandages that can sense infections or freshness-sensing food packaging.
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