讨论了化学研磨原理及金属哑光表面控制。
The principles of chemical grinding and the control of matt metal surface were discussed.
半导体制程技术包括氧化、扩散、热处理、合金化、再流动制程、铜制程及化学机械研磨制程简介。
Introduction to semiconductor manufacturing technology including oxidation, diffusion, alloying, re-flow process, copper process and chemical-mechanical polishing.
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