更容易在工艺上实现。这种结构上制作的器件比在单晶基板上实现的 器件更可靠。
The components which are processed through the structure are more reliable than the components which are realized on the single-crystal base plate.
经过深加工的玻璃基板，尺寸能达到极限公差。适用于多晶硅，单晶硅切割时使用的玻璃基板。
After processing the glass substrate, the size limits of tolerance can be achieved. For polysilicon, single use when cutting silicon substrates.
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