... 化学镀 electroless plating 化学镀金 chemigold plating 化学镀镍 electroless Ni plating ...
基于6个网页-相关网页
... immersion gilding 浸镀金,化学置换法镀... chemical gilding 化学镀金 electric gilding [电] 电镀金 ...
基于6个网页-相关网页
Non-cyanide is an important development direction of electroless gold plating.
化学镀金的无氰化发展,即以非氰金盐、络合剂代替镀金液中的CN-,是化学镀金的一个重要发展方向,是在氰化物镀金基础上的一个重大进步。
参考来源 - 无氰化学镀金工艺的研究·2,447,543篇论文数据，部分数据来源于NoteExpress
利用化学镀镍作阻挡层，化学镀金作可焊层，可得到良好的焊接效果。
Good soldering result may be obtained by applying electroless nickel as barrier layer and electroless gold as top layer to provide solderability.
文中针对化学镀金中镀液组分的主盐与络合剂、稳定剂和缓冲剂的筛选与优化等关键技术进行了研究和阐述。
This paper studied and discussed the determination and optimization of the principal salt, complexing agent, stabilizer, and buffering contained in plat...
采用化学镀方法在玻璃纤维上沉积金属镀层，制得镀金属的导电玻璃纤维，用作导电涂料的填料。
A conductive glass fibre has been prepared by deposition of metals on the glass fibre via chemical electroplating process, which can be used as the filler of conductive coatings.
应用推荐