化学沉铜(Electroless 化学沉铜(Electroless Copper) 化学沉铜：完成金属铜的沉积，实现孔的导通( 化学沉铜：完成金属铜的沉积，实现孔的导通(金 属化) 是印制板的重要加工流程。
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化学沉铜是否对电镀空洞有积极的持续改善小组？
Is there an active continuous improvement team for plating voids in the electroless copper operation?
其最大的难点是化学沉铜前的聚四氟乙烯活化前处理，也是最为关键的一步。
The biggest difficulty is chemical deposition of copper of PTFE activation pretreatment, is also the most crucial step.
提出了一种有较高沉铜速率和稳定性的碳纤维化学镀技术。
An electroless deposition technique on carbon fiber with higher copper deposition rate and stability was presented.
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