电子工业用加成型液体硅橡胶灌封料的关键技术指标为：胶料黏度、硫化胶力学性能和电性能。
The key properties of additional liquid silicone potting material in electronic industry are viscosity, mechanical property and dielectric property.
以含环氧基聚二甲基硅氧烷为基胶，以胺类化合物为固化交联剂进行了新型加成型硫化硅橡胶的研究。
By using polydimethylsiloxane containing epoxy groups as base gum, the compounds containing amino groups as crosslinking reagent, a new addition type curable silicone rubber were prepared.
本文合成两种新型加成型硅橡胶：TAS硅橡胶和MDAS硅橡胶，与通常使用的乙烯基加成型硅橡胶进行了对比。
Two new types of addition silicone rubber, TAS silicone rubber and MDAS silicone rubber, were synthesized and compared with the normal vinyl addition silicone rubber.
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