X-ray result indiciates that GaAs power chip welding has low voidage less than 10%. The welding process is achieved by clamp assemblying, little artificial influence and high rate of finished products.
X射线检测结果表明,微波GaAs功率芯片焊接具有较低的空洞率,焊透率高达90%以上,焊接过程主要通过夹具装配完成,人为影响因素少,成品率高。
参考来源 - 微波GaAs功率芯片的低空洞率真空焊接技术研究·2,447,543篇论文数据，部分数据来源于NoteExpress
最后提出了提高功率芯片可靠性的建议。
Finally, some Suggestions are put forward for improving the reliability of power chip.
小功率芯片集成封装，灯条之间可进行串联或并联，点亮后灯条之间无暗区。
Low power chip integrated package, light strip can be connected in series or parallel, no dark.
其中一个例子就是第六种元素T1功率芯片，这是安装在水里管的车的散热系统。
One example is the Sixth Element T1 Power Chip, which is fitted onto the water pipe of the car's radiator system.
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