化学镀锡工艺在微电子行业具有很好的应用前景。
The process of electroless tin plating has wide applications in microelectronic filed.
灵活性和可扩展性大大提高、具有很好的应用前景。
With the flexibility and extensibility greatly improved, it has a very good application future.
高梯度磁分离技术在除尘方面具有很好的应用前景。
High gradient magnetic separation technology has good application foreground in dust removal.
应用推荐