阐述了国内外免清洗焊剂和无铅焊锡膏的研究现状及其在电子组装技术中的应用前景。
The research on and the application in the electronic assembly technology of the two materials are reviewed.
免清洗型助焊剂虽然已广泛的被使用，但仅限于消费性、低成本的PC B组装。
Although no-clean flux has already been widely used, the application is still limited to consumed, low-cost PCB assembly.
制备的免清洗助焊剂多项性能满足规范要求，解决了助焊性与腐蚀性的矛盾。
The diversified properties of the no-clean flux met the standard requirements, and solved the problem be…
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