两方法可为筛选光电子器件封装提供依据，并为优化封装的设计提供参考。
The two methods are useful for screening and optimizing the packaging of high-speed optoelectronics devices.
本文采用理论、数值模拟、实验等方法系统的研究了MEMS和光电子器件气密封装工艺中的关键技术问题。
This dissertation conduct fundamental research into several key issues of hermetic MEMS and optoelectronic devices by integrating theory, numerical simulation, and experiments.
应用推荐