采用体微机械加工技术和硅硅键合技术可以实现高性能的加速度传感器。
Using bulk micromachining and silicon bonding we can achieve high-performance full-silicon sandwich accelerometer.
在加工工艺方面，与体微机械加工相比表面微机械加工具有工艺简单，容易与CMOS电路集成等优点。
Compared with bulk micromachining, the surface micromachining has the advantages of low manufacturing cost and easy integration with CMOS circuits.
微电子机械系统(MEMS)是结合微电子技术和微机械加工技术制造而成的微型机电一体化系统。
Micro electro mechanical systems (MEMS) are the micro mechatronics fabricated by microelectronic technology and micromachining.
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