解理断裂是典型的脆性断裂，解理断裂也是一个裂纹萌生和扩展的过程，其机制与位错和晶粒有关。
Cleavage fracture is a typical brittle fracture and also a process consisted of crack producing and spreading, and the mechanism is related to dislocation and crystalline grain.
当腐蚀促进的位错发射和运动达到临界状态时，应力腐蚀裂纹形核和扩展。
Microcracks of SCC initiated when the corrosion-enhanced dislocation emission and motion reached a certain condition.
疲劳裂纹扩展阶段裂纹尖端附近为形成于铁素体晶粒内的位错胞及亚晶。
Dislocation cell and sub grain formed in ferrite grain are found at the stage of fatigue crack propagation in the area of crack tip.
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