该镀层的可焊性优良，可作为印刷电路板和元器件的表面镀层，从而实现电子封装的无铅化。
The coating has excellent solder properties and can be used on the surfaces of printed circuit board and patch-like electronic apparatus in order to carry out lead-free electronic packing.
在纳米印刷法中，提供一种离模性和转印精度优良的模具。
Provided is a metal mold excellent in the mold-release characteristic and the transfer accuracy in a nano-imprint method.
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