而IBM芯片制造技术联盟中的另一个重要成员三星则最近公布了其20nm制程技术的有关消息，这种制程技术也是基于平面型体硅CMOS。
Samsung Electronics Co. Ltd., one of the members of IBM's "fab club" or technology alliance, recently rolled out its 20-nm process, which is based on bulk CMOS.
将回光反射人工标志成功应用于天线面型检测中，通过17.2米某星载天线与50米口径天线测量，验证了编码标志在自动化测量中发挥的重要作用。
The Retro-reflective targets and coded targets were applied successfully in detecting shapes of an antenna with a diameter of 17.2m loaded on a satellite and another lager one with a diameter of 50m.
在圆片规模上开始加工，结束于芯片规模的圆片级封装技术将在面型阵列倒装芯片的封装中得到日益广泛的应用。
The WLP technology that initiates processing from Wafer-Level and finishes in chip scale will be applicable on a daily broadening scale in plane array FCP.
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