一级封装中最流行的互连技术仍为丝焊。
Wire bonding is still the most popular interconnect technology in the first-level packaging.
实现了双丝焊参数的数字化输入与显示。
Thus, digital input and display of parameters in twin-wire welding was achieved.
丝焊方法，半导体器件，丝焊的毛细管及球块形成方法。
Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method.
应用推荐