本文提出了一种解非线性不可微方程的迭代方法，分析了其收敛性并给出了误差估计，取得了很好的效果。
In this paper, a method is presented for solving non differentiable equations in Banach space. At the same time, we analysis its convergence and get error estimates.
随着微电子封装焊点尺寸的微型化，微连接尺寸效应对焊点的本构方程产生不可忽视的影响。
With the downsizing of solder joints in microelectronic packaging, size effect in micro-joining plays an more important role in the constitutive equation of the solder joints.
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