在冲向这堵墙的过程中，为了保持速度，通过把集成电路堆叠起来增加密度，闪存业已开始制造三维芯片。
To keep up speed on the way to the wall, the industry has begun building three-dimensionalchips by stacking circuits on topof one another to increase densities.
垂直互连是三维微波和毫米波集成电路中的典型结构。
Vertical interconnections are typical structures in three dimensional microwave and millimeter wave integrated circuits.
第三章详细介绍了采用超声波方法进行三维人体坐标测量的硬件电路设计。
Third chapter introduced in detail about USES the ultrasonic wave method to carry on the three dimensional human body coordinates survey the hardware circuit design.
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