板上倒装芯片(FCOB)作为一种微电子封装结构形式得到了广泛的应用。

Flip Chip on Board (FCOB) has been used widely as a microelectronics packaging structural form.

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QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。

Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.

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