1.  salient point
2.  protruding point
3.  emboss
4.  bump

• 1. 凸点: emboss | Bumping | salient point
• 2. 平面凸点式封装: FBP
• 3. 焊接凸点: solder bump

更多释义

• 1.介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
  This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems.
  dict.yoduao.com
• 2.实验通过选择性地对涂敷在CCL基板上的钎料进行激光加热并熔化，最后形成焊料凸点矩阵。
  The experiment is conducted by selective laser heating and melting the thin solder layer and then preprinting it on CCL in order to form the matrix with solder pads.
  dict.yoduao.com
• 3.详细阐述了CSP的几项主要的关键技术：即结构设计技术，凸点制作技术，包封技术和测试技术。
  We particularly expatiated some key technology about CSP: structure designing technology, Solder Bumping making technology, envelopment technology, testing technology.
  dict.yoduao.com

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