• 1. semiconductor substrate: 半导体衬底
• 2. Gilding apparatus for semiconductor substrate: 发明名称

• 1.In an embodiment, the method includes forming a gate dielectric layer on a semiconductor substrate.
  实施例中，本方法包括在半导体衬底上形成栅极电介质层。
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• 2.The assembly of the film frame tape, the thinned semiconductor substrate, and the C4 grind tape is diced.
  切割膜框架带、减薄的半导体衬底和C4研磨带的组件。
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• 3.A C4 grind tape and a laser-ablative adhesive layer are formed on a front side of a semiconductor substrate.
  在半导体衬底的正面形成C4研磨带和激光烧蚀粘合层。
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