• 1. Flip chip: 倒装芯片 | 覆晶技术 | 覆晶
• 2. flip chip bonder: 倒装焊接机 | 倒装片接合机 | 设备 | 覆晶固晶机
• 3. flip chip bonding: 倒装焊接 | 侧装片接合 | 倒装焊

更多释义

• 1.The process of flip chip based on aluminum nitride is studied.
  研究了以氮化铝为基板的倒扣封装的工艺。
  dict.yoduao.com
• 2.The embedded active chip also can be realized by backside thinning and flip chip bonding.
  通过对芯片进行背面减薄和倒装连接，可以实现有源芯片的埋嵌。
  dict.yoduao.com
• 3.Flip chip technology has become one of the major joining technologies in electronic packaging.
  摘要覆晶技术已成为电子构装中之主要接合技术之一。
  dict.yoduao.com

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