• 1. flip-chip bonding: 倒装芯片安装 | 倒装晶片安装
• 2. flip chip bonding: 倒装焊接 | 侧装片接合 | 倒装焊
• 3. ultrasonic flip-chip bonding: 超声倒装焊

更多释义

• 1.The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.
  将实现3d互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。
  dict.yoduao.com
• 2.This article presents acid could be used to wash the indium bumps before flip chip bonding, based on indium oxide dissolved in acid.
  利用氧化铟易于溶于酸性溶液的性质，提出了在倒装焊接之前使用酸性溶液对铟柱进行酸洗。
  dict.yoduao.com
• 3.This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.
  介绍了芯片倒装焊的重要意义、发展趋势、基本的焊球类型、制作方法及焊球质量的检测技术。
  dict.yoduao.com

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