• 1. Sn-Ag: 共熔锡 | 银合金
• 2. Sn-Ag-Cu: 锡
• 3. Sn-Ag合金: SnAg alloy

更多释义

• 1.Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.
  着重介绍了电镀金、金锡、锡铅、锡银和化学镀镍凸点的工艺过程，最后简单介绍了制备凸点的电镀设备。
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• 2.The Bainiuchang Ag deposit is a large Ag-Sn-pb-Zn deposit discovered and explored in recent years.
  白牛厂银矿是近年发现探明的一大型银锡铅锌矿床。
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• 3.The associated gold mineralization can be classified into two types: Au (Ag) -bearing polymetallic skarn sulphide Sn-Cu deposit and Au-be.
  伴生金矿床可分为含金(银)多金属矽卡岩硫化锡铜矿床及含金脉(层)状锡铅矿床。
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