当把玻璃液倒在锡液上时，玻璃的底面也会变得完全平整。
When pouring molten glass onto the molten tin, the underside of the glass would also be perfectly flat.
当我打开它显然是在锡液的光泽。
可以根据需要，设定喷流锡液的高度及流量；
Three. Tin wave can TIMER set jet time, PC plate and the parts are not easy to be damaged;
介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。
Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.
介绍了光亮硫酸盐镀锡液中各成分作用及其工艺流程，对锡镀层变色的原因进行了分析。
Function of each component in solution and process flow of bright sulfate Sn plating were introduced. Tarnish reasons of Sn deposit were analyzed.
本文将从合理使用拉边机、稳定锡液对流、稳定玻璃液流等方面所采取的有效措施作一些介绍。
This article also describes some efficient steps for operating edge roller , stabilizing convection of tin fluid and settling flow of glass fluid .
并对现有的镀液分析方法进行了比较，确定了快速连续测定化学镀锡液中亚锡离子和次磷酸钠的方法。
The existing bath analyzing methods are compared, as a result a quick and continous method for determining sodium hypophosphite and stannum(II) ion in electroless tin bath is determined.
它是丝状的，以锡的氧化物为正极，锂钴氧化物为负极，悬浮在离子电解液中。
It's a filament made from tin oxide anode and lithium cobalt oxide cathode suspended in an ionic liquid electrolyte.
研究了从焦磷酸盐槽液中电镀锡镍合金的一种新工艺，讨论了一些电镀参数对锡镍合金镀层的影响。
A new technology of tin-nickel alloy electroplating from a pyrophosphating bath was studied. The effect of some plating parameters on the tin-nickel alloy coating was discussed.
在本文提出的柠檬酸盐配方镀液中能镀得锡锌合金镀层。添加剂7880可使镀层光亮并细化组织。
Tin-zinc alloy can be electrodeposited from the citrate bath containing additional agent 7880. Additive 7880 can make the deposit fine and bright.
但纯锡电镀中存在着许多问题，如锡晶须、镀层变色及镀液混浊等。
However, it suffers from some problems such as tin whisker, surface color changes and bath mudding.
研究了一种新型可焊性光亮锡锑合金电镀工艺的镀液配方和电镀操作条件；
A new electroplating technology of solderable bright Sn-Sb alloy of bath components and operating conditions were studied.
此法已被成功应用于测定锡-铜-铅合金电镀液及其镀层中的锡、铜和铅。
Cu and Pb ions in the alloy plating bath and composition of its deposits.
在研究碱性锡镍合金的电沉积过程中，讨论了镀液中各成分的含量、电镀工艺条件的改变及添加剂对锡镍合金镀层成分和外观的影响规律。
The effect of bath composition, operating conditions and additives on Sn content of electrodeposits during the process of Sn-Ni alloy electroplating in alkaline baths had been studied.
本文简要介绍锡铈镍合金电镀工艺。本工艺镀液稳定，电镀层质量好。
This text simply introduce the technology for Sn-Ce-Ni alloy electroplating. Plating solution is stable. Coat quality is good.
采用标准加入原子吸收分光光度法测定铅锡合金锭液中铅的浓度，试验确定了最佳的测定条件。
The lead concentration in Pb-Sn alloy plating bath was determined by standard additional atomic ab-sorption spectrometry, and the optimal determination conditions were obtained.
研究了锡钴合金镀层的基本特性、镀液的性能、镀液中杂质的影响及故障处理和废水治理。
The character of the tin-cobalt alloy coating, properties of the bath, influence of the impurities in the bath, troubleshooting and wastewater treatment are also studied.
以硝酸-磺酸型退锡剂为基础配方，研制了一种脱除废旧电路板表面残留焊锡的剥离液。
A new stripper for removing the solder from the surface of waste printed circuit boards was developed on the basis of a nitric acid - sulfonic acid type tin stripper.
综述了接插件连续镀金、钯、锡的电镀工艺，包括设备、镀液和镀层性质。
Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.
研究了硫化沉淀法分离ito废靶硫酸浸出液中铟、锡的工艺。
A novel technology of separating indium and tin from sulphuric acid leach solution of ITO waste target by sulphuration precipitation has been developed.
介绍了BH-411光亮硫酸镀锡的工艺配方、工艺流程和镀液的维护与管理，讨论了镀液中的硫酸、硫酸亚锡和添加剂的作用。
The process formula and flow of BH-411 bright sulfate tin plating, maintenance and management of the bath were introduced.
采用正交试验研究了氰化镀铜锡合金工艺中各因素水平与镀液、镀层性能的关系，优选出一种最佳工艺配方。
A cyanide tin - copper plating process was optimized by means of orthogonal test. The effect of bath components of electrolytic solutions and electrodeposits was investigated.
认为液相色谱对产品的分布提供了可靠的数据，对生产过程的控制提供了依据。总锡含量的测定以原子吸收光谱法较准确和简便。
The result shows that the distribution of product base on liquid chromatogram data, using AAS to determine the content of Sn is exact and simple.
介绍了电镀铜锡合金工艺的研究进展和应用、电镀铜锡合金镀液配方和工艺条件。
The research progresses and applications of Cu-Sn alloy plating process are presented, and the bath formulations and operational conditions of Cu-Sn alloy plating process are also introduced.
方法应用抗坏血酸作基体改进剂，横向塞曼石墨炉原子吸收光谱法直接测定浸泡液中痕量锡。
Methods L-Ascorbic acid is used as matrix modifier in the direct Zeeman GFAAS to determine trace Sn.
向二氧化钛的悬浮液中加入锡化合物的溶液和锑、磷等化合物的溶液。
A solution of a tin compound and a solution of compounds of antimony, phosphorus, etc. are added to a suspension obtained by suspending the titanium dioxide.
数值计算与实验结果表明，金属射流在惰性气体环境下受激振破碎形成均匀金属液滴束流，收取到了均匀尺寸的金属锡球状粉末。
The results proved that the metal jet was broken up to form uniform droplet stream under periodic longitudinal vibration in inert gas, and the sphere uniform tin powders wa…
锡炉表面光泽如镜，且液相体较佳，焊接性能更好，减低浪费。
Solder has highly reflective surface and low viscosity, for improved soldering and reduced waste.
浮法玻璃是在盛有金属浮抛液的锡槽中进行的。
The measurement of the zebra angle of float glass with virtual Moire fringe method;
浮法玻璃是在盛有金属浮抛液的锡槽中进行的。
The measurement of the zebra angle of float glass with virtual Moire fringe method;
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