无钎剂软钎焊技术可以从根本上解决因钎剂的副作用而带来的一系列问题。
Fluxless soldering can solve a series of problems caused by the side effect of flux essentially.
随着微电子表面组装技术的迅猛发展，软钎料尤其是无铅钎料逐渐成为研究的焦点。
The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).
钎料厚度较厚时钎焊变形较大。
加压可以作为一种改性钎缝金属的方式。
Bonding pressure imposition can be used as one of the methods modifying braze metal.
对该钎剂进行了不挥发物含量、腐蚀率试验。
给出了不同的钎料量对应的焊点剖面形态的变化。
And the different section shape of the solder joint is given with the variation of solder volume.
介绍了适合于汽车散热器钎焊用的锌基钎料特点。
The characteristics of zinc-base filler metal for auto- mobile radiator soldering is introduced in the paper.
由实验结果可知钎料凸台可以提供足够的剪切强度。
It is shown that the bumps can supply sufficient shear strength for use.
对电真空钎料溅散性的各种影响因素进行分析对比。
Different influence factors on the spatter property of the electronics vacuum filler metals have been analysed and contrasted.
本文研究了铜对低硼、低铬镍基钎料工艺性能的影响。
The effect of copper on low boron low chromium nickel based brazing alloy was studied by experiments.
研制了铝硬钎焊用钎料膏，对其工艺性能进行了研究。
A solder paste used for brazing was developed and its technical performance was investigated.
采用高功率横流CO2激光扫描钎料合金与金刚石颗粒。
High power transverse flow CO2 laser was used to scan the brazing alloy and diamond grits.
同时，钎缝圆角几何形状对这一热应力分布有重要影响。
Meanwhile, the fillet geometry has played an important role on this thermal stress distribution.
同时，本文还对PBGA钎料球激光重熔进行了试验研究。
At the same time, experiments on PBGA solder ball laser reflow were carried out.
介绍了各种焊接方法的优缺点以及钎料、钎剂的开发进展。
The advantages and disadvantages of various welding methods and development of filler metals and fluxes are introduced.
同时发现，钎料的冷却方式对钎料的脆性倾向有较大的影响。
In addition, it was found that the cooling mode affect the brittleness tendency of the solder greatly.
由于无铅钎料润湿性较差，在实际生产中普遍采用氮气保护。
Nitrogen Protection is used in practical industry because of poor wettability of lead-free solder.
结合我们的研究成果，详细介绍了无铅钎料开发的现状及前景。
In combination of our recent results, the current status and prospect on lead-free solders has been introduced in detail.
结合目前的研究成果，详细介绍了无铅钎料开发的现状及前景。
In combination of the recent results, the current status and prospect on lead-free solders has been introduced in detail.
本文研究了影响镍基钎料钎焊不锈钢接头性能的主要工艺参数。
Main technology parameters of effects on brazing stainless steel joints using nickel base filler metal have been studied.
研究接头形状、钎缝厚度对焊后残余应力的大小及分布规律的影响。
The effects of joint shapes and filler metal thickness on the distribution of residual stress were researched.
与氟化物共晶型钎剂相比，有熔点低、流动性好、制备方便等优点。
Comparing with fluoride eutectic fluxes, it possesses the advantages as: low melting temperature, good wetting ability, easy to prepare, etc.
共晶钎料BGA球焊点的抗剪强度比锡铅合金钎料自身的抗剪强度大。
The shear strength of BGA joint with eutectic solder is higher than that of tin-lead alloy itself.
接头抗剪强度表明，在一定范围内，采用复合钎料可以明显提高接头强度。
Shear results of joints show that joint strength can be increased obviously in a certain range with composite soldering materials.
为了提高凿岩钎杆用中空钢的使用寿命，设计了奇数边截面形状的中空钢。
In order to enhance the service hfe of hollow steel for rock drill stem, the odd number side section shape hollow steel has been designed.
通过SEM/EDAX以及热力学方法分析了钎焊接头组织及钎缝的成分分布。
The joint structure and element distribution at brazing seam are also studied by SEM/EDAX and thermodynamics measures.
结果表明，银基电触头材料应选用石墨坩埚熔炼，银基钎料应选择粘土坩埚熔炼。
The results show that silver based electric materials ought to be smelted by graphite crucible, the clay crucible is suitable for smelting silver based solder.
锡炉材料特别是与流动钎料接触比较紧密的部分应尽量避免直接使用不锈钢材料。
The material used for solder pot, particularly for the part with a tight contact with flow solder, should avoid direct use of stainless steel.
锡炉材料特别是与流动钎料接触比较紧密的部分应尽量避免直接使用不锈钢材料。
The material used for solder pot, particularly for the part with a tight contact with flow solder, should avoid direct use of stainless steel.
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